Huawei Expected to Break Semiconductor Barriers with Development of High-End 3nm GAA Chips; Tape-Out by 2026 ...Middle East

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Huawei Expected to Break Semiconductor Barriers with Development of High-End 3nm GAA Chips; Tape-Out by 2026

In a major move, Huawei plans to develop a high-end node for the domestic chip industry, the 3nm GAA, which would put the Chinese firm in a competitive position. Huawei Plans To Accelerate Chip Efforts In The Coming Years, Developing a Cutting-Edge 3nm Node There's no doubt that Huawei is emerging as one of China's most dominant companies in innovating and adjusting product portfolios to compete with Western alternatives. The firm has a deep-rooted business, not just in the mobile segment, but also in AI and computing, making it a force not to be reckoned with. In a report by Taiwan […]

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