No easy options as pressure to pass chips funding bill grows ...Middle East

Bipartisan interest in moving a popular package of semiconductor manufacturing incentives outside of a stalled conference committee is growing, with the August recess viewed as a hard deadline. The urgency surrounds the $50 billion-plus grants package for companies that invest domestically, which lawmakers and top administration officials say can’t wait for negotiations on other more […] The post No easy options as pressure to pass chips funding bill grows appeared first on Roll Call.

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